Henkel / Bergquist – Wärmeleitmaterialien (Gap-Filler, Gap-Pads, Sil-Pads etc.)

NEU / NEW
BERGQUIST microTIM mTIM 1000 SERIES
MICRO-THERMAL INTERFACE COATINGS FOR PLUGGABLE OPTICAL MODULES

Bergquist

BERGQUIST microTIM mTIM 1029 (Datenblatt)

Bergquist

BERGQUIST microTIM mTIM 1013 (Datenblatt)

Produkte

ProduktgruppeBezeichnung / Artikel-Kurzbeschreibung
Gap Filler Liquid Dispensed MaterialsGap Filler 1000
Gap Filler 1000SR
Gap Filler 1100SF
Gap Filler 1400SL
Gap Filler 1500
Gap Filler 1500LV
Gap Filler 2000
Gap Filler 3500LV
Gap Filler 3500S35
Gap Filler 4000
GAP PAD Thermally Conductive MaterialsGap Pad 1000HD
Gap Pad 1000SF
Gap Pad 1450
Gap Pad 1500
Gap Pad 1500R
Gap Pad 1500S30
Gap Pad 2000S40
Gap Pad 2200SF
Gap Pad 2202SF
Gap Pad 2500S20
Gap Pad 3000S30
Gap Pad 3004SF
Gap Pad 3500ULM
Gap Pad 5000S35
Gap Pad A2000
Gap Pad A3000
Gap Pad EMI 1.0
Gap Pad HC 3.0
Gap Pad HC 5.0
Gap Pad HC1000
Gap Pad VO
Gap Pad VO Soft
Gap Pad VO Ultra Soft
Gap Pad VO Ultra Soft Black
Sil-Pads Thermally Conductive InsulatorsSil-Pad 1100ST (Soft Tack)
Sil-Pad 1200
Sil-Pad 1500ST (Soft Tack)
Sil-Pad 2000
Sil-Pad 400
Sil-Pad 800
Sil-Pad 900S
Sil-Pad 980
Sil-Pad A1500
Sil-Pad A2000
Sil-Pad K-10
Sil-Pad K-4
Sil-Pad K-6
Sil-Pad Shield
Sil-Pad Tube
HI-FLOW Phase Change Interface MaterialsHi-Flow 105
Hi-Flow 225F-AC
Hi-Flow 225U
Hi-Flow 225UT
Hi-Flow 300G
Hi-Flow 300P
Hi-Flow 565U
Hi-Flow 565UT
Hi-Flow 625
Hi-Flow 650P
BOND-PLY and LIQUI-BOND AdhesivesBond-Ply 100
Bond-Ply 400
Bond-Ply 660P
Bond-Ply 800
Bond-Ply LMS-HD
EIF 1000
Liqui-Bond EA 1805
Liqui-Bond SA 1000
Liqui-Bond SA 1800
Liqui-Bond SA 2000
Liqui-Bond SA 3505
Liqui-Form 2000
Liqui-Form 3500
Thermal Interface CompoundsTIC 1000A
TIC 4000
TLB 400 SLT
Poly-PadsPoly-Pad 1000
Poly-Pad 400
Poly-Pad K-10
Poly-Pad K-4
Q-PadsQ-Pad 3
Q-Pad II
TCF Materials TCF 1000
TCF 2000 AF
Thermal CladsThermal Clad HPL-03015
Thermal Clad HR T30.20
Thermal Clad HT-04503
Thermal Clad HT-07006
Thermal Clad MP-06503