Henkel / Bergquist – Wärmeleitmaterialien (Gap-Filler, Gap-Pads, Sil-Pads etc.)
NEU / NEW
BERGQUIST GAP FILLER TGF 3000SF
High Dispense Rate, Silicone-Free Gap Filler
Bergquist
BERGQUIST GAP FILLER TGF 3000SF
NEU / NEW
BERGQUIST GAP FILLER TGF 4500CVO, 2k silicone, two components – requires mixing
Bergquist
BERGQUIST GAP FILLER TGF 4500CVO, 2k silicone, two components (Datenblatt)
- Thermal conductivity: 4.5 W/mK
- Extended working time for manufacturing flexibility
- Controlled Volatile Silicone
NEU / NEW
BERGQUIST microTIM mTIM 1000 SERIES
MICRO-THERMAL INTERFACE COATINGS FOR PLUGGABLE OPTICAL MODULES
Bergquist
BERGQUIST microTIM mTIM 1029 (Datenblatt)
Bergquist
BERGQUIST microTIM mTIM 1013 (Datenblatt)
Produkte
Auswahlhilfe Auswahlhilfe für Henkel Electronics-Produkte
| Produktgruppe | Bezeichnung / Artikel-Kurzbeschreibung |
|---|---|
| Gap Filler Liquid Dispensed Materials | Gap Filler 1000 |
| Gap Filler 1000SR | |
| Gap Filler 1100SF | |
| Gap Filler 1400SL | |
| Gap Filler 1500 | |
| Gap Filler 1500LV | |
| Gap Filler 2000 | |
| Gap Filler 3500LV | |
| Gap Filler 3500S35 | |
| Gap Filler 4000 | |
| GAP PAD Thermally Conductive Materials | Gap Pad 1000HD |
| Gap Pad 1000SF | |
| Gap Pad 1450 | |
| Gap Pad 1500 | |
| Gap Pad 1500R | |
| Gap Pad 1500S30 | |
| Gap Pad 2000S40 | |
| Gap Pad 2200SF | |
| Gap Pad 2202SF | |
| Gap Pad 2500S20 | |
| Gap Pad 3000S30 | |
| Gap Pad 3004SF | |
| Gap Pad 3500ULM | |
| Gap Pad 5000S35 | |
| Gap Pad A2000 | |
| Gap Pad A3000 | |
| Gap Pad EMI 1.0 | |
| Gap Pad HC 3.0 | |
| Gap Pad HC 5.0 | |
| Gap Pad HC1000 | |
| Gap Pad VO | |
| Gap Pad VO Soft | |
| Gap Pad VO Ultra Soft | |
| Gap Pad VO Ultra Soft Black | |
| Sil-Pads Thermally Conductive Insulators | Sil-Pad 1100ST (Soft Tack) |
| Sil-Pad 1200 | |
| Sil-Pad 1500ST (Soft Tack) | |
| Sil-Pad 2000 | |
| Sil-Pad 400 | |
| Sil-Pad 800 | |
| Sil-Pad 900S | |
| Sil-Pad 980 | |
| Sil-Pad A1500 | |
| Sil-Pad A2000 | |
| Sil-Pad K-10 | |
| Sil-Pad K-4 | |
| Sil-Pad K-6 | |
| Sil-Pad Shield | |
| Sil-Pad Tube | |
| HI-FLOW Phase Change Interface Materials | Hi-Flow 105 |
| Hi-Flow 225F-AC | |
| Hi-Flow 225U | |
| Hi-Flow 225UT | |
| Hi-Flow 300G | |
| Hi-Flow 300P | |
| Hi-Flow 565U | |
| Hi-Flow 565UT | |
| Hi-Flow 625 | |
| Hi-Flow 650P | |
| BOND-PLY and LIQUI-BOND Adhesives | Bond-Ply 100 |
| Bond-Ply 400 | |
| Bond-Ply 660P | |
| Bond-Ply 800 | |
| Bond-Ply LMS-HD | |
| EIF 1000 | |
| Liqui-Bond EA 1805 | |
| Liqui-Bond SA 1000 | |
| Liqui-Bond SA 1800 | |
| Liqui-Bond SA 2000 | |
| Liqui-Bond SA 3505 | |
| Liqui-Form 2000 | |
| Liqui-Form 3500 | |
| Thermal Interface Compounds | TIC 1000A |
| TIC 4000 | |
| TLB 400 SLT | |
| Poly-Pads | Poly-Pad 1000 |
| Poly-Pad 400 | |
| Poly-Pad K-10 | |
| Poly-Pad K-4 | |
| Q-Pads | Q-Pad 3 |
| Q-Pad II | |
| TCF Materials | TCF 1000 |
| TCF 2000 AF |
